{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Laminated socket contacts", "item": "https://www.patentleaderboard.com/patent/6575766"}]}
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Home › Laminated socket contacts

Laminated socket contacts

US Patent 6575766 · Granted Jun 10, 2003

Estimated economic value: $73,878,000 ⓘ

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