Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package having an exposed heat spreader

Semiconductor package having an exposed heat spreader

US Patent 6552428 · Granted Apr 22, 2003

Estimated economic value: $432,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power module of electric assisted bicycle2025
Speed-command generating unit of electric vehicle, and speed-command generating 2024
Web camera2024
Web camera2023
Defining routing domain for distributed packet processing2023
System and method for compensating acceleration of electrical motorbike2022
Method for fabricating carrier-free semiconductor package2022
Electric motor controlling system and vibration suppression method for using the2022
Defining routing domain for distributed packet processing2021
Carrier-free semiconductor package and fabrication method2020
Systems and methods for vehicle telematics registration2019
System and method for providing automatic high-value listing feeds for online co2019