Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of producing an interconnect structure for an integrated circuit

Method of producing an interconnect structure for an integrated circuit

US Patent 6548396 · Granted Apr 15, 2003

Estimated economic value: $39,567,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Monolithic complementary field-effect transistors having carbon-doped release la2025
Method of dielectric material fill and treatment2024
Methods and apparatus for forming backside power rails2024
Doped selective metal caps to improve copper electromigration with ruthenium lin2024
Method of forming nickel silicide materials2024
Fully aligned subtractive processes and electronic devices therefrom2024
Reverse selective etch stop layer2024
Subtractive metals and subtractive metal semiconductor structures2024
Methods and devices for subtractive self-alignment2024
Method of cleaning a structure and method of depositing a capping layer in a str2023
Multi-step pre-clean for selective metal gap fill2023
Methods and apparatus for processing a substrate2023