Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Constant impedance routing for high performance integrated circuit packaging

Constant impedance routing for high performance integrated circuit packaging

US Patent 6518663 · Granted Feb 11, 2003

Estimated economic value: $26,368,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Conversion of heat to electricity using phase transformations in ferroelectric o2021
Coaxial four-point probe for low resistance measurements2015
Coaxial four-point probe for low resistance measurements2012
Structure and method of high performance two layer ball grid array substrate2010
Wire bonded semiconductor device having low inductance and noise2007
Low capacitance coupling wire bonded semiconductor device2007
Semiconductor package with conductor impedance selected during assembly2006
FA tool using conductor model2006
Structure and method of high performance two layer ball grid array substrate2006
Low capacitance coupling wire bonded semiconductor device2004
System for electrically modeling an electronic structure and method of operation2004
Structure and method of high performance two layer ball grid array substrate2004