Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Insulating adhesive tape for a semiconductor chip package having a copper lead frame

Insulating adhesive tape for a semiconductor chip package having a copper lead frame

US Patent 6452282 · Granted Sep 17, 2002

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Detachable mooring system for offshore structure2025
Ingot growing apparatus comprising heater and method for manufacturing heater fo2025
Ampoule cap2020
Cosmetic composition comprising osmanthus asiaticus extract and clematis apiifol2019
Method for preparing cosmetic composition containing fermented ginseng berry Ple2019
Saturated polyester for plastic containers with excellent heat resistance and ga2007
Domestic nanofiltration membrane based water purifier without storage tank2005
Channel resource management method in base station using dynamic function in mob2004
Reverse osmosis membrane having excellent anti-fouling property and method for m2003
Method for the preparation of polyamic acid and polyimide2001
Method for the preparation of polyamic acid and polyimide2001
Method for the preparation of polyamic acid and polyimide2001