Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6452282 | Insulating adhesive tape for a semiconductor chip package having a copper lead frame | Soon Sik Kim, Kyeong Ho Chang, Kyung Rok Lee | 2002-09-17 |
| 6320019 | Method for the preparation of polyamic acid and polyimide | Kyung Rok Lee, Soon Sik Kim, Kyeong Ho Chang | 2001-11-20 |
| 6307008 | Polyimide for high temperature adhesive | Kyung Rok Lee, Soon Sik Kim, Kyeong Ho Chang | 2001-10-23 |
| 6252033 | Method for the preparation of polyamic acid and polymide useful for adhesives | Soon Sik Kim, Kyeong Ho Chang, Kyung Rok Lee | 2001-06-26 |