Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6452282 | Insulating adhesive tape for a semiconductor chip package having a copper lead frame | Jeong Min Kweon, Soon Sik Kim, Kyung Rok Lee | 2002-09-17 |
| 6320019 | Method for the preparation of polyamic acid and polyimide | Kyung Rok Lee, Soon Sik Kim, Jeong Min Kweon | 2001-11-20 |
| 6312801 | Adhesive tape for electronic parts | Soon Sik Kim, Hwa-il Jin | 2001-11-06 |
| 6307008 | Polyimide for high temperature adhesive | Kyung Rok Lee, Soon Sik Kim, Jeong Min Kweon | 2001-10-23 |
| 6252033 | Method for the preparation of polyamic acid and polymide useful for adhesives | Jeong Min Kweon, Soon Sik Kim, Kyung Rok Lee | 2001-06-26 |
| 5955606 | N-vinyllactam derivatives and polymer thereof | Jin Baek Kim, Min Ho Jung | 1999-09-21 |
| 5750680 | N-vinyllactam derivatives and polymer thereof | Jin Baek Kim, Min Ho Jung | 1998-05-12 |