Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages

Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages

US Patent 6432742 · Granted Aug 13, 2002

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stacked die assembly having reduced stress electrical interconnects2014
Electrically interconnected stacked die assemblies2014
Electrically interconnected stacked die assemblies2014
Flip chip molded/exposed die process and package structure2006
Enhanced BGA grounded heatsink2004
Disposable mold runner gate for substrate based electronic packages2004
Single unit automated assembly of flex enhanced ball grid array packages2004
Method of assembling a package with an exposed die backside with and without a h2004
Flip chip molded/exposed die process and package structure2003
Molded stiffener for flexible circuit molding2003
Coplanarity inspection at the singulation process2003
Single unit automated assembly of flex enhanced ball grid array packages2003