Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method

Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method

US Patent 6419567 · Granted Jul 16, 2002

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Configuration and method for mounting a backing film to a polish head2007
Method and configuration for conditioning a polishing pad surface2006
Arrangement and method for conditioning a polishing pad2006
Self-aligned mask to reduce cell layout area2005
Configuration for polishing disk-shaped objects2004
Recessed metal lines for protective enclosure in integrated circuits2004
Wafer cleaning apparatus2004
Method for determining an endpoint and semiconductor wafer2003
Polishing head for wafer, and method for polishing2002
Manufacturing self-aligned polysilicon fet devices isolated with maskless shallo2000
Method of filling shallow trenches1998
Process for the production of masks having a metal carrier foil1985