Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermally enhanced semiconductor ball grid array device and method of fabrication

Thermally enhanced semiconductor ball grid array device and method of fabrication

US Patent 6365980 · Granted Apr 2, 2002

Estimated economic value: $33,186,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Inflatable medical implant having a pressure monitor2025
Motion and vibration cuing system2015
Grenite: a composite material exhibiting high impact, scratch and stain resistan2015
Motion seat2014
Apparatus and method for mounting of cabinets2013
Hinge adjustment tool and method of use2004
Lead frame tooling design for bleed barrier groove2002
Lead frame tooling design for bleed barrier groove2002
Lead frame tooling design for exposed pad features2002
Lead frame tooling design for exposed pad features2002
Integrated circuit device with depressions for receiving solder balls and method2002
Integrated circuit device with depressions for receiving solder balls and method2002