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Home › Flip-chip on flex for high performance packaging applications

Flip-chip on flex for high performance packaging applications

US Patent 6365962 · Granted Apr 2, 2002

Estimated economic value: $46,572,000 ⓘ

Assignee

Intel

Inventors

Chunlin Liang (32 patents)
Larry E. Mosley (42 patents)
Xiao-Chun Mu (27 patents)

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