Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Decapsulation techniques for multi-chip (MCP) devices

Decapsulation techniques for multi-chip (MCP) devices

US Patent 6358852 · Granted Mar 19, 2002

Estimated economic value: $4,163,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Personal warming apparatus2010
Personal warming apparatus2010
Crescent warmer2010
Crescent warmer2010
Butterfly-shaped warmer2009
Crescent warmer2008
Personal warming apparatus2008
Capsule warmer2008
Method for isolating a failure site in a wordline in a memory array2008
Performing passive voltage contrast on a silicon on insulator semiconductor devi2005
Self-contained personal warming apparatus and method of warming2005
Detecting heat generating failures in unpassivated semiconductor devices2005