{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Liposome preparation and material encapsulation method", "item": "https://www.patentleaderboard.com/patent/6355267"}]}
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Home › Liposome preparation and material encapsulation method

Liposome preparation and material encapsulation method

US Patent 6355267 · Granted Mar 12, 2002

Estimated economic value: $567,447,000 ⓘ

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