Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic interconnection medium having offset electrical mesh plane

Electronic interconnection medium having offset electrical mesh plane

US Patent 6255600 · Granted Jul 3, 2001

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High temperature equalized electrical parasitic power packaging method for many 2015
Low noise high thermal conductivity mixed signal package2012
Low noise high thermal conductivity mixed signal package2011
Method of packaging RF MEMS2006
RC terminator and production method therefor2006
Decoupling capacitor for integrated circuit package and electrical components us2004
Apparatus and method for providing low-loss transmission lines in interconnected2004
Surface applied passives2004
Method of making capacitor with extremely wide band low impedance2003
Electronic interconnection medium having offset electrical mesh plane2002
Multichip module and method of forming same2001
Floating plate capacitor with extremely wide band low impedance2001