Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configuration

Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configuration

US Patent 6249052 · Granted Jun 19, 2001

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package with solder-filled via holes in molding layers2010
Chip-embedded support-frame board wrapped by folded flexible circuit for multipl2008
Screen print under-bump metalization (UBM) to produce low cost flip chip substra2006
Design of interconnection pads with separated probing and wire bonding regions2004
Configuration for testing a substrate mounted with a most performance-demanding 2004
Solder balls and columns with stratified underfills on substrate for flip chip j2002
Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site 2001
Face-to-face (FTF) stacked assembly of substrate-on-bare-chip (SOBC) modules2000
Multiple chip module configuration to simplify testing process and reuse of know1999
Leaded semiconductor device having accessible power supply pad terminals1996
Liquid encapsulated ball grid array semiconductor device with fine pitch wire bo1995
Thermally enhanced semiconductor device having exposed backside and method for m1995