Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming a contact

Method of forming a contact

US Patent 6248664 · Granted Jun 19, 2001

Estimated economic value: $18,207,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Using a backside mask layer for forming a unique die mark identifier pattern2022
Method for increasing semiconductor device wafer strength2021
Abrasive articles and methods of forming the same2020
Abrasive article having a core including a composite material2019
Method for making an electronic component package2019
Localized redistribution layer structure for embedded component package and meth2018
Optically-masked microelectronic packages and methods for the fabrication thereo2018
Localized redistribution layer structure for embedded component package and meth2017
Wafer level packages and methods for producing wafer level packages having delam2016
Method for shielding MEMS structures during front side wafer dicing2016
Semiconductor device package and method of manufacture2016
Electronic devices with embedded die interconnect structures, and methods of man2016