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Home › Obtaining the better defect performance of the fuse CMP process by adding slurry polish on more soft pad after slurry polish

Obtaining the better defect performance of the fuse CMP process by adding slurry polish on more soft pad after slurry polish

US Patent 6248002 · Granted Jun 19, 2001

Estimated economic value: $3,143,000 ⓘ

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