Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Plasma deposition of spin chucks to reduce contamination of silicon wafers

Plasma deposition of spin chucks to reduce contamination of silicon wafers

US Patent 6242364 · Granted Jun 5, 2001

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Yield and line width performance for liquid polymers and other materials2009
Yield and line width performance for liquid polymers and other materials2009
Yield and line width performance for liquid polymers and other materials2007
Yield and line width performance for liquid polymers and other materials2007
Yield and line width performance for liquid polymers and other materials2007
Yield and line width performance for liquid polymers and other materials2007
Method of uniformly coating a substrate2006
Method of uniformly coating a substrate2005
Method of uniformly coating a substrate2005
Plasma deposition of spin chucks to reduce contamination of Silicon wafers2005
Plasma deposition of spin chucks to reduce contamination of Silicon wafers2005
Plasma deposition of spin chucks to reduce contamination of Silicon wafers2005