Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thin multi-layer circuit board having a remodeling pad layer and a metallic barrier layer with an exclusion zone

Thin multi-layer circuit board having a remodeling pad layer and a metallic barrier layer with an exclusion zone

US Patent 6184476 · Granted Feb 6, 2001

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vehicle control device2025
Carbon-dioxide capture and treatment system and carbon-dioxide negative emission2025
Power supply device2025
Steering control device and standard value adjustment method2025
Control device for vehicle2025
Authentication device, authentication method, and recording medium2025
Notification apparatus, notification method, notification system, and computer r2024
Substrate, method for manufacturing substrate, and electronic device2024
External stimulus application system, external stimulus condition determination 2024
Filter unit quality management system and filter unit quality management method2023
Vehicle seat for supporting seat cushion while permitting lateral movement2022
Agrochemical composition and dispersal method therefor2022