Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Balancing of x and y axis bonding by 45 degree capillary positioning

Balancing of x and y axis bonding by 45 degree capillary positioning

US Patent 6131792 · Granted Oct 17, 2000

Estimated economic value: $71,954,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wire bond wires for interference shielding2025
Wire bond wires for interference shielding2023
Wire bond wires for interference shielding2022
Wire bond wires for interference shielding2020
Embedded wire bond wires2019
Wire bond wires for interference shielding2018
Wafer-level packaging using wire bond wires in place of a redistribution layer2018
Wire bond wires for interference shielding2017
Ball bonding metal wire bond wires to metal pads2017
Coupling of side surface contacts to a circuit platform2016
Wafer-level packaging using wire bond wires in place of a redistribution layer2016
Wire bond wires for interference shielding2016