Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same

Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same

US Patent 6100178 · Granted Aug 8, 2000

Estimated economic value: $29,792,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Lighting system for appliance2012
LED interconnection integrated connector holder package2009
Electronic packaging materials for use with low-k dielectric-containing semicond2009
LED interconnect spring clip assembly2009
Headlamp assembly with integrated housing and heat sink2008
Bulkhead flatwire integration units2008
Convectively cooled headlamp assembly2008
Assembly comprising multiple microelectronic modules2007
Microelectronic package within cylindrical housing2007
Apparatus and method for protecting an electronic circuit2007
Electronically integrated vehicle structure2006
Underhood electronic interior integration2006