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Home › Process for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holes

Process for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holes

US Patent 6098280 · Granted Aug 8, 2000

Estimated economic value: $34,993,000 ⓘ

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