Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for bonding micromachined wafers using solder

Process for bonding micromachined wafers using solder

US Patent 6062461 · Granted May 16, 2000

Estimated economic value: $58,683,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Tracking system and method thereof2020
Microfluidic device and microtube thereof2015
System having wireless implantable sensor2014
Fluidic systems and methods of determining properties of fluids flowing therein2014
Process of making a microtube and microfluidic devices formed therewith2013
Microfluidic device and method of use2013
Microfluidic device and methods of operation and making2012
Process of fabricating microfluidic device chips and chips formed thereby2011
Fluid delivery system and sensing unit therefor2011
Microfluidic device and method of operation2011
Method of treating a bodily fluid2011
System and method of assessing a property of a flowing fluid2010