Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming conductive lines on a semiconductor wafer

Method of forming conductive lines on a semiconductor wafer

US Patent 5994241 · Granted Nov 30, 1999

Estimated economic value: $27,589,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Self-encapsulated silver alloys for interconnects2010
Self-encapsulated silver alloys for interconnects2009
Self-encapsulated silver alloys for interconnects2007
Selective polishing with slurries containing polyelectrolytes2005
Sliding window structure with sash guiding tracks2005
Selective polishing with slurries containing polyelectrolytes2004
Polishing compositions and use thereof2003
Method of forming a solute-enriched layer in a substrate surface and article for2002
Dual-valent rare earth additives to polishing slurries2001
Apparatus and method for forming thin film using ink-jet mechanism2001
Dual-valent rare earth additives to polishing slurries2000
CMP process using indicator areas to determine endpoint1999