Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Plural semiconductor die housed in common package with split heat sink

Plural semiconductor die housed in common package with split heat sink

US Patent 5977630 · Granted Nov 2, 1999

Estimated economic value: $13,133,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High current capacity semiconductor device package and lead frame with large are2003
High current capacity semiconductor device package and lead frame with large are2003
Nickel-iron expansion contact for semiconductor die2003
High current capacity semiconductor device package and lead frame with large are2002
High current capacity semiconductor device package and lead frame with large are2002
Semiconductor device package with plural pad lead frame2002
Chip scale package2002
High current semiconductor device package with plastic housing and conductive ta2002
Chip scale packaging process2001
High current capacity semiconductor device housing2001
Surface mount semiconductor package2001
Surface mount semiconductor package2001