{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "C4 package die backside coating", "item": "https://www.patentleaderboard.com/patent/5936304"}]}
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Home › C4 package die backside coating

C4 package die backside coating

US Patent 5936304 · Granted Aug 10, 1999

Estimated economic value: $109,908,000 ⓘ

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