Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin

Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin

US Patent 5834537 · Granted Nov 10, 1998

Estimated economic value: $21,430,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for fabricating a photovoltaic device by uniform plating on dielectric pa2019
Method for fabricating a photovoltaic device by uniform plating on emitter-lined2017
Electrically conductive adhesive (ECA) for multilayer device interconnects2016
Toughness, adhesion and smooth metal lines of porous low K dielectric interconne2015
Polishing pads including phase-separated polymer blend and method of making and 2015
Method for preserving the firmness and internal pressure of a resin cartridge an2015
Solar cells with plated back side surface field and back side electrical contact2014
Polishing pad with porous elements and method of making and using the same2014
Selectively coated self-aligned mask2013
Non-lithographic method of patterning contacts for a photovoltaic device2013
Circuitized substrate with low loss capacitive material and method of making sam2013
Lead frames with improved adhesion to plastic encapsulant2013