{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for etching dielectric using fluorohydrocarbon gas, NH.sub.3 -generating gas, and carbon-oxygen gas", "item": "https://www.patentleaderboard.com/patent/5814563"}]}

Home › Method for etching dielectric using fluorohydrocarbon gas, NH.sub.3 -generating gas, and carbon-oxygen gas

Method for etching dielectric using fluorohydrocarbon gas, NH.sub.3 -generating gas, and carbon-oxygen gas

US Patent 5814563 · Granted Sep 29, 1998

Estimated economic value: $39,493,000 ⓘ

Assignee

Applied Materials

Inventors

Ji Ding (20 patents)
Hongching Shan (34 patents)
Michael Welch (38 patents)

View full patent text on Google Patents →