Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip package board having utility rings

Chip package board having utility rings

US Patent 5801440 · Granted Sep 1, 1998

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Output mapping of die pad bonds in a ball grid array1997
Output mapping of die pad bonds in a ball grid array1997
Semiconductor board providing high signal pin utilization1997
Semiconductor board providing high signal pin utilization1997
Multi-voltage circuit arrangement and method for accommodating hybrid electronic1996