Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5801440 | Chip package board having utility rings | Hu-Kong Lai | 1998-09-01 |
| 5703402 | Output mapping of die pad bonds in a ball grid array | Hu-Kong Lai | 1997-12-30 |
| 5686699 | Semiconductor board providing high signal pin utilization | Hu-Kong Lai | 1997-11-11 |
| 5508653 | Multi-voltage circuit arrangement and method for accommodating hybrid electronic system requirements | Terng-Huei Lai | 1996-04-16 |