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Hu-Kong Lai — 3 Patents

AMAcc Microelectronics: 3 patents #2 of 6Top 35%
San Jose, CA: #14,517 of 32,062 inventorsTop 50%
California: #149,087 of 386,348 inventorsTop 40%
Overall (All Time): #1,640,577 of 4,157,543Top 40%
3 Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
5801440 Chip package board having utility rings Edwin Chu 1998-09-01
5703402 Output mapping of die pad bonds in a ball grid array Edwin Chu 1997-12-30
5686699 Semiconductor board providing high signal pin utilization Edwin Chu 1997-11-11

Nearby-Ranked Inventors

Hisatoshi Mochida3
Hideo Odashima3
Joseph Eray3
Hugh P. Campbell3
Kyotaro Hirasawa3
David LeFevre3
Richard Freudenberger3
Renato P. Apollonio3
Ryukichi Wada3