Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for conditioning a chemical mechanical polishing pad

Apparatus and method for conditioning a chemical mechanical polishing pad

US Patent 5775983 · Granted Jul 7, 1998

Estimated economic value: $26,381,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chemical mechanical polishing retaining ring2013
Chemical mechanical polishing system having multiple polishing stations and prov2011
Chemical mechanical polishing system having multiple polishing stations and prov2009
Fluid-pressure regulated wafer polishing head2006
Chemical mechanical polishing retaining ring2004
Chemical mechanical polishing carrier head2003
Hydraulically actuated wafer clamp2003
Driving a carrier head in a wafer polishing system2003
Fluid-pressure regulated wafer polishing head2002
Drive system for a carrier head support structure2002
Fluid pressure regulated wafer polishing head2001
Circumferentially oscillating carousel apparatus for sequentially processing sub2001