Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flip chip monolithic microwave integrated circuit with mushroom-shaped, solder-capped, plated metal bumps

Flip chip monolithic microwave integrated circuit with mushroom-shaped, solder-capped, plated metal bumps

US Patent 5773897 · Granted Jun 30, 1998

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wide-band transparent electrical contacts and interconnects for FPAS and a metho2017
Enhancement mode normally-off gallium nitride heterostructure field effect trans2015
Enhancement mode normally-off gallium nitride heterostructure field effect trans2014
Integrated structure with transistors and schottky diodes and process for fabric2013
Integrated structure with transistors and Schottky diodes and process for fabric2011
Piezoelectric MEMS integration with GaN technology2009
Non-planar nitride-based heterostructure field effect transistor2007
Method for fabricating a non-planar nitride-based heterostructure field effect t2004
Stacked multiple quantum well superlattice infrared detector2003
High efficiency flip-chip monolithic microwave integrated circuit power amplifie2001
Via transitions for use as micromachined circuit interconnects2001
MEMS based tile assemblies and methods of fabrication2001