Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Epoxy resin molding for sealing electronic parts containing organic polymer-grafted silicone

Epoxy resin molding for sealing electronic parts containing organic polymer-grafted silicone

US Patent 5739217 · Granted Apr 14, 1998

Estimated economic value: $140,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Analysis method and analysis unit for determining radiological result data2024
Device for preparing food2022
Mirror, in particular for a microlithographic projection exposure apparatus or a2021
Wavefront correction element for use in an optical system2020
Method for producing a mirror element2019
Laminating body2019
Reflective optical element2019
Mask for EUV lithography, EUV lithography apparatus and method for determining a2018
Reflective optical element and optical system for EUV lithography2018
Mirror, in particular for a microlithographic projection exposure apparatus2017
Mirror for the EUV wavelength range, method for producing such a mirror, and pro2017
Chain saw2017