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Home › Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap

Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap

US Patent 5734560 · Granted Mar 31, 1998

Estimated economic value: $13,730,000 ⓘ

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