Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of assembling and cooling a package structure with accessible chip

Method of assembling and cooling a package structure with accessible chip

US Patent 5687474 · Granted Nov 18, 1997

Estimated economic value: $6,250,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wire bond integrated circuit package for high speed I/O2010
Ball grid array package layout supporting many voltage splits and flexible split2010
Integrated circuit package substrate with high density routing mechanism2005
Integrated circuit package substrate with multiple voltage supplies2004
Active trace rerouting2004
Contact escape pattern2002
Method of fabricating a BGA package using PCB and tape in a die-up configuration2002
Reinforced sealing technique for an integrated circuit package2001
Reinforced sealing technique for an integrated circuit package2001
BGA package using PCB and tape in a die-up configuration2000
Printed circuit board layout to minimize the clock delay caused by mismatch in l2000
BGA package using PCB and tape in a die-down configuration1999