Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wireless radio frequency power semiconductor devices using high density interconnect

Wireless radio frequency power semiconductor devices using high density interconnect

US Patent 5637922 · Granted Jun 10, 1997

Estimated economic value: $133,193,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Phased array antenna with isotropic and non-isotropic radiating and omnidirectio2023
Phased array antenna with isotropic and non-isotropic radiating and omnidirectio2022
Phased array antenna with isotropic and non-isotropic radiating and omnidirectio2022
Electronics package including integrated electromagnetic interference shield and2021
Acoustic phased array antenna with isotropic and non-isotropic radiating element2020
Electronics package with integrated interconnect structure and method of manufac2020
Electronics package with integrated interconnect structure and method of manufac2020
Multilayer interconnect structure with buried conductive via connections and met2020
Semiconductor logic device and system and method of embedded packaging of same2020
Electronics package with integrated interconnect structure and method of manufac2020
Electronics package including integrated electromagnetic interference shield and2020
Device almost last embedded device structure and method of manufacturing thereof2019