Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Adhesion between dielectric layers in an integrated circuit

Adhesion between dielectric layers in an integrated circuit

US Patent 5627403 · Granted May 6, 1997

Estimated economic value: $11,750,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thermoelectric generator2024
Method of fabrication of an integrated thermoelectric converter, and integrated 2023
Process for manufacturing a micromechanical structure having a buried area provi2015
Process for manufacturing a micromechanical structure having a buried area provi2014
Method of fabrication of plastic film supported single crystal silicon photovolt2012
Process of final passivation of an integrated circuit device2005
Planarization structure and method for dielectric layers2003
Process for the production of a semiconductor device having better interface adh2003
Process for the production of a semiconductor device having better interface adh2003
Process for realizing an intermediate dielectric layer for enhancing the planari2002
Process for realizing an intermediate dielectric layer for enhancing the planari2001
Method for final passivation of integrated circuit2001