Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dielectric structures having embedded gap filling RIE etch stop polymeric materials of high thermal stability

Dielectric structures having embedded gap filling RIE etch stop polymeric materials of high thermal stability

US Patent 5565529 · Granted Oct 15, 1996

Estimated economic value: $13,145,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Water consumption monitor2013
Unified numerical and semantic analytics system for decision support2013
System and method for querying data streams2013
Public relations and reputation mining via semantic analytics2013
Electrically conductive polymeric materials and use thereof2009
Risk and compliance framework2009
Tamper-responding encapsulated enclosure having flexible protective mesh structu2005
Method for biometric-based authentication in wireless communication for access c2004
Electrically conductive and abrasion/scratch resistant polymeric materials, meth2004
Low k dielectric materials with inherent copper ion migration barrier2004
System and method for assigning unique identifier to deleted unopened original s2004
Energy sensitive electrically conductive admixtures, uses thereof, methods of fa2004