Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer tray and ceramic blade for semiconductor processing apparatus

Wafer tray and ceramic blade for semiconductor processing apparatus

US Patent 5556147 · Granted Sep 17, 1996

Estimated economic value: $16,373,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Food components having high protein content2024
Starch aqueous fermentation feedstock and a method for the production thereo2023
Integrated mixotrophic fermentation method2021
Chemical mechanical polishing system having multiple polishing stations and prov2011
Error avoidance in data transmission using dynamic modification of analog sampli2010
Error masking for data transmission using received data2010
Tandem process chamber2010
Chemical mechanical polishing system having multiple polishing stations and prov2009
Method and apparatus for processing a wafer2009
Conformal nanolaminate dielectric deposition and etch bag gap fill process2009
Vehicle gyro based steering assembly angle and angular rate sensor2009
Method of forming a damascene structure with integrated planar dielectric layers2008