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Home › Semiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chip

Semiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chip

US Patent 5457299 · Granted Oct 10, 1995

Estimated economic value: $16,991,000 ⓘ

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