Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Die bonding connector and method

Die bonding connector and method

US Patent 5426266 · Granted Jun 20, 1995

Estimated economic value: $2,455,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High resolution low power consumption OLED display with extended lifetime2019
Thermal expansion compensated metal lead frame for integrated circuit package1992
High thermal conductivity/low alpha emission molding compound containing high pu1990
Thermal expansion compensated metal lead frame for integrated circuit package1990
Test fixture capable of electrically testing an integrated circuit die having a 1989
Integrated circuit lead frame assembly containing voltage bussing and distributi1989
Chip on board package for integrated circuit devices using printed circuit board1988
Method of making a package utilizing a self-aligning photoexposure process1987
Process of making a semiconductor device having parallel leads directly connecte1986