Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High thermal conductivity/low alpha emission molding compound containing high purity semiconductor filler and integrated circuit package

High thermal conductivity/low alpha emission molding compound containing high purity semiconductor filler and integrated circuit package

US Patent 4931852 · Granted Jun 5, 1990

Estimated economic value: $1,550,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High resolution low power consumption OLED display with extended lifetime2019
High productivity spray processing for the metallization of semiconductor workp2016
Interlevel dielectric with multiple air gaps between conductive lines of an inte1999
Short channel self-aligned VMOS field effect transistor1999
Short channel self aligned VMOS field effect transistor1998
Method of accurate compositional analysis of dielectric films on semiconductors1998
Die bonding connector and method1995
TiW barrier metal process1994
Thermal expansion compensated metal lead frame for integrated circuit package1992
Thermal expansion compensated metal lead frame for integrated circuit package1990
Test fixture capable of electrically testing an integrated circuit die having a 1989
Integrated circuit lead frame assembly containing voltage bussing and distributi1989