Candice H. Brown — 10 Patents at AMD

Candice H. Brown has been granted 10 US patents while listed as an inventor at AMD. The first was granted in 1986 and the most recent in March 2019. Candice H. Brown ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Candice H. Brown in Sebastopol, CA, US.

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10229956	High resolution low power consumption OLED display with extended lifetime	Michael Hack, Michael S. Weaver, Julia J. Brown, Woo-Young So	2019-03-12	$31,770,000
5426266	Die bonding connector and method	Davar I. Roshanagh	1995-06-20	$2,455,000
5126820	Thermal expansion compensated metal lead frame for integrated circuit package	—	1992-06-30	$5,219,000
4931852	High thermal conductivity/low alpha emission molding compound containing high purity semiconductor filler and integrated circuit package	Homi Fatemi	1990-06-05	$1,550,000
4918511	Thermal expansion compensated metal lead frame for integrated circuit package	—	1990-04-17	$2,939,000
4820976	Test fixture capable of electrically testing an integrated circuit die having a planar array of contacts	—	1989-04-11	$2,469,000
4801999	Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers	James Hayward	1989-01-31	$3,974,000
4729061	Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom	—	1988-03-01	$5,584,000
4640010	Method of making a package utilizing a self-aligning photoexposure process	—	1987-02-03	$7,173,000
4616406	Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein	—	1986-10-14	$3,938,000

Candice H. Brown — 10 Patents

Issued Patents All Time

Patent Widget