Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming a multilayer microelectronic wiring module

Method for forming a multilayer microelectronic wiring module

US Patent 5259110 · Granted Nov 9, 1993

Estimated economic value: $9,110,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Theater rigging system2010
Theater rigging system2009
Continuous winder1998
Multilayer microelectronic wiring module and method for forming the same1996
Multilayer microelectronic wiring module and method for forming the same1996
Multilayer microelectronic wiring module and method for forming the same1996
High density electronic connector and method of assembly1995
High density electronic connector and method of assembly1995
Access bank container system1995
Via and pad structure for thermoplastic substrates and method and apparatus for 1995
Via and pad structure for thermoplastic substrates and method and apparatus for 1995
Via and pad structure for thermoplastic substrates and method and apparatus for 1995