Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Resin-encapsulated semiconductor device having a particular mounting structure

Resin-encapsulated semiconductor device having a particular mounting structure

US Patent 5150193 · Granted Sep 22, 1992

Estimated economic value: $44,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Movement identification device2025
Table game device2024
Fatigue management system2023
Information processing apparatus, information processing method, and program2022
Information processing device, information processing method, and moving image d2021
Lead frame, method for manufacturing lead frame, semiconductor device, and metho2018
Information processing device, control method, and storage medium2017
Lead frame, method for manufacturing lead frame, semiconductor device, and metho2017
Radio communication device, radio communication method, and radio communication 2016
Resin-sealed semiconductor device and associated wiring and support structure2016
Method of manufacturing a semiconductor device2016
Semiconductor device and manufacturing method therefor2016