Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device

Assignee

• Dai Nippon Printing Co.

Inventors

• Satoshi Shibasaki (4 patents)
• Koji Tomita (31 patents)
• Masaki Yazaki (11 patents)
• Kazuyuki Miyano (17 patents)
• Atsushi Kurahashi (4 patents)
• Kazuhito Uchiumi (3 patents)
• Masachika Masuda (85 patents)

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