Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip

Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip

US Patent 5135890 · Granted Aug 4, 1992

Estimated economic value: $15,057,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Matrix stages solid state ultrafast switch2017
Device and method for controlling the turn-off of a solid state switch (SGTO)2015
Matrix-stages solid state ultrafast switch2015
Matrix-stages solid state ultrafast switch2013
Method to enhance operating characteristics of FET, IGBT, and MCT structures2003
Method and apparatus for removal of coatings and oxidation from transit vehicles2003
Devices formable by low temperature direct bonding2001
Methods for making semiconductor devices by low temperature direct bonding2001
Hermetic thin pack semiconductor device2000
Advanced methods for making semiconductor devices by low temperature direct bond2000
Method for applying metal-filled solventless resin coating2000
One mask, power semiconductor device fabrication process2000