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Home › Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant

Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant

US Patent 5106785 · Granted Apr 21, 1992

Assignee

Siemens Aktiengesellschaft

Inventors

Siegfried Rauchmaul (3 patents)
Hans-Fr. Schmidt (8 patents)
Juergen Bednarz (3 patents)
Karl-Heinz Horsmann (4 patents)
Ralf Criens (2 patents)
Horst Scheffler (4 patents)
Hanns-Heinz Peltz (4 patents)

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