Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5376824 | Method and an encapsulation for encapsulating electrical or electronic components or assemblies | Siegfried Rauchmaul, Juergen Bednarz, Karl-Heinz Horsmann, Ralf Criens, Horst Scheffler +1 more | 1994-12-27 |
| 5134056 | Method for applying a solder resist layer to a printed circuit board | Helmut Hadwiger, Milan Prochazka, Eddy Roelants | 1992-07-28 |
| 5106785 | Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant | Siegfried Rauchmaul, Juergen Bednarz, Karl-Heinz Horsmann, Ralf Criens, Horst Scheffler +1 more | 1992-04-21 |
| 5044074 | Method for manufacturing metal core printed circuit boards | Helmut Hadwiger | 1991-09-03 |
| 5008496 | Three-dimensional printed circuit board | Siegfried Rauchmaul, Juergen Bednarz | 1991-04-16 |
| 4996391 | Printed circuit board having an injection molded substrate | — | 1991-02-26 |
| 4924590 | Method for making metal core printed circuit board | Helmut Hadwiger | 1990-05-15 |
| 4853252 | Method and coating material for applying electrically conductive printed patterns to insulating substrates | Juergen Frankel, Antoon Mattelin, Pol Pecceu, Ferdinand Quella, Luc Boone +2 more | 1989-08-01 |